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Apple didn't t ell 10 things about iPhone 7, iPhone 7 Plus

photo credit-PC online Apple didn't t ell 10 things about iPhone 7, iPhone 7 Plus Wonder what's inside Apple's...




photo credit-PC online




Apple didn't t ell 10 things about iPhone 7, iPhone 7 Plus


Wonder what's inside Apple's new iPhones? The innards that make the world's 'favourite gadgets' what they are? Recent tear downs reports by Chipworks, teardown.com and iFixit.com have revealed the names of the companies that provide some of the most important components of these smartphones.Also, Apple traditionally never discloses the battery, RAM and other such details too of iPhones. These teardowns reveal such specifications too.So, read on to know the 10 things that Apple didn't tell you about its all-new iPhone 7 and iPhone 7 Plus...








1.Intel inside

Apple's latest iPhones officially have Intel inside. According to a teardown by research companies Chipworks and teardown.com, both owned by TechInsights, Intel is the key supplier of LTE modems in the new iPhone 7 and iPhone 7 Plus. Intel reportedly has four components: baseband LTE modem, two transceivers and a power management chip.








2.Qualcomm modems


However, since Intel modems don't support CDMA, iPhone 7 versions using this technology sport Qualcomm's modems, according to Chipworks.As per a report in Forbes, "It appears that Qualcomm-equipped phones will be sold in the US (Verizon and Sprint), China, Hong Kong, Puerto Rico and the United States Virgin Islands. Meanwhile, Intel-equipped phones will be sold in the US (AT&T and T-Mobile) and most other countries in the world."


                           


3.TSMC processor


The A10 Fusion processor in the iPhone 7 is being single sourced from TSMC. According to Chipworks, Apple's part number for the A10 is APL1W24, 339S00255 vs the Apple A9, which was APL1022, 339S00129.






4.Microphones

iPhone 7 has three microphones, one at the bottom of the phone and two at the top. The microphones at the bottom are said to have been sourced by Goertek and Knowles. As per iFixit teardown of iPhone 7 Plus, STMicroelectronics has also "scored design wins" into the device.

                               


5.Flash memory from SK Hynix and Toshiba


As for flash memory, teardowns reveals marks of SK Hynix and Toshiba.


                          

6.iSight camera: Sony


iPhone 7's iSight camera has a larger, F/1.8 aperture, as compared to the F/2.2 aperture used for iPhone 6s/6s Plus. The iSight camera chip was sourced from Sony and fabricated using its Exmor RS technology platform.

                       

7.Touch-screen controller

According to Chipworks, the Touch Controller for iPhone 7 is manufactured by Universal Scientific Industries (USI) with markings O1 1R. It is the same as the iPhone 6S -- a pressure-sensitive 3D Touch layer that buzzes slightly when you press and hold the screen/static home button. Chipworks says that though no markings were found on the IC, it is believed to be of Analog Devices.
                     


8.Wi-Fi: Murata


The Wi-Fi/Bluetooth socket has been won by Murata with a module part number 339S00199 as per Chipworks.

                                 

9.GPS: Broadcom



Broadcom too wins a slot in the iPhone 7 as per Chipworks. It possibly contains Sensor Hub functionality as well like BCM4773 & BCM4774 seen in Samsung devices.


                                

10.Battery

According to iFixit's teardown, the battery is rated at 3.82 V and 2900mAh, for a total of 11.1 Wh, a slight upgrade over the 10.45 Wh (3.8 V, 2750mAh) of the 6s Plus, and on par with the 11.1 Wh, 2915mAh cell found in the 6 Plus.




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